SEMICON Taiwan 2026 | new challenges in semiconductor manufacturing

SEMICON Taiwan 2026 | new challenges in semiconductor manufacturing

26/08/25: The future of the semiconductor industry is not defined by more powerful chips alone, but by the ability to reliably manage increasingly complex manufacturing and packaging processes.
Technologies such as chiplets, 3D-ICs and heterogeneous integration are placing new demands on facilities, cleanrooms and infrastructure.
At CRC, we help semiconductor companies build the foundation for successful investments, facility expansions and long-term growth, from planning to project delivery.
We’re looking forward to connecting with semiconductor manufacturers, technology innovators and industry partners at SEMICON Taiwan to discuss the challenges and opportunities shaping the next generation of semiconductor manufacturing.
📍 Visit us at the German Pavilion, hosted by the German Trade Office Taipei and Silicon Saxony | TaiNEX Hall 1, 1F | Booth #2760
Let’s talk about the engineering behind tomorrow’s semiconductor fabs.